ナノ構造を型押しする方法及び装置

Title:

ナノ構造を型押しする方法及び装置

Document Type and Number:

Japanese Patent JP6391709

Kind Code:

B2

Abstract:

A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.

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Inventors:

Geralt Kleindle

Application Number:

JP2016563848A

Publication Date:

September 19, 2018

Filing Date:

April 22, 2014

Export Citation:

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Assignee:

Afau Group A Tarner Gamebehr

International Classes:

H01L21/027; B29C59/02; H01L21/683

Domestic Patent References:

JP2011211157A
JP2012099790A
JP2014027075A

Foreign References:

WO2012133840A1
WO2013023708A1

Attorney, Agent or Firm:

Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima

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