Title:
部品実装ラインおよび部品実装方法
Document Type and Number:
Japanese Patent JP6402364
Kind Code:
B2
Abstract:
A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.
More Like This:
| WO/2010/094346 | SUBSTRATE INVERTING SYSTEM |
| WO/2013/153598 | MOUNTING HEAD CLEANING DEVICE |
Inventors:
Satoshi Adachi
Shinjiro Tsuji
Nobuyuki Kakita
Yamada Shingo
Shinjiro Tsuji
Nobuyuki Kakita
Yamada Shingo
Application Number:
JP2015065866A
Publication Date:
October 10, 2018
Filing Date:
March 27, 2015
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/04; H01L21/60; H05K3/32
Domestic Patent References:
| JP2011165890A | ||||
| JP2013089631A | ||||
| JP2006135082A | ||||
| JP2007235178A | ||||
| JP2014154775A | ||||
| JP2015012135A | ||||
| JP2012039043A | ||||
| JP2012164706A |
Foreign References:
| US20060163724 |
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda