Title:
銅バンプ用液状封止材、および、それに用いる樹脂組成物
Document Type and Number:
Japanese Patent JP6405209
Kind Code:
B2
Abstract:
Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).
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Inventors:
Tomoya Yamazawa
Toshi Yoshii
Toshi Yoshii
Application Number:
JP2014244026A
Publication Date:
October 17, 2018
Filing Date:
December 02, 2014
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08L63/00; C08K5/54; C08K9/06; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2002226673A | ||||
| JP2011089025A | ||||
| JP2012149237A | ||||
| JP2013018991A |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa