Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP6406138
Kind Code:
B2
Abstract:
A semiconductor device includes a substrate, a laminated wiring layer unit, a nitride film disposed on the laminated wiring layer unit, a semiconductor element portion, a sealing portion surrounding the element portion. In the sealing portion, multiple wiring layers are connected with a sealing layer to configure a sealing structure which surrounds the element portion. The laminated wiring layer unit includes an uppermost layer which is made of material having higher adhesion to an uppermost wiring layer, and a protection insulating film made of material having higher adhesion to the sealing layer than the nitride film is disposed on the nitride film. In the sealing portion, a via-hole is defined in the protection insulating film, the nitride film, and the uppermost insulating film to partially expose the uppermost wiring layer. The sealing layer is embedded into the via-hole and is also disposed on a protection insulating film around the via-hole.
Inventors:
Koji Eguchi
Application Number:
JP2015127992A
Publication Date:
October 17, 2018
Filing Date:
June 25, 2015
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
| JP2001267325A | ||||
| JP2008270232A | ||||
| JP2011035309A | ||||
| JP2014123611A |
Foreign References:
| WO2006121129A1 |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office