Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6408038
Kind Code:
B2
Inventors:
Yoshiharu Kaneda
Application Number:
JP2017001812A
Publication Date:
October 17, 2018
Filing Date:
January 10, 2017
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L23/50; H01L21/60; H01L23/48
Domestic Patent References:
| JP2000503491A | ||||
| JP2011129875A | ||||
| JP2003209132A | ||||
| JP55068646A | ||||
| JP2007294530A | ||||
| JP2008042100A | ||||
| JP2005353976A |
Foreign References:
| WO1998024128A1 | ||||
| WO2011039795A1 |
Attorney, Agent or Firm:
Yamato Tsutsui
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji
Atsushi Sugada
Akiko Tsutsui
Tetsuya Sakaji