Title:
パッケージ基板
Document Type and Number:
Japanese Patent JP6409442
Kind Code:
B2
Abstract:
A package substrate includes resin insulating interlayers, and four or more conductive layers including dedicated wiring layers such that the dedicated wiring layers are two dedicated wiring layers which transmit data between a first electronic component and a second electronic component connected by the two dedicated wiring layers.
Inventors:
Yasushi Inagaki
Osamu Tai Nagane
Osamu Tai Nagane
Application Number:
JP2014192718A
Publication Date:
October 24, 2018
Filing Date:
September 22, 2014
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L23/12; H01L25/04; H01L25/18; H05K3/46
Domestic Patent References:
| JP2012164794A | ||||
| JP2007250960A |
Attorney, Agent or Firm:
Akito Tashita