導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

Title:

導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

Document Type and Number:

Japanese Patent JP6411194

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a conductive particle which, when electrodes are connected electrically, can come in sufficient contact with the electrode to lower connection resistance and, further, can make corrosion of a conductive layer difficult to occur.SOLUTION: Provided is a conductive particle 1 comprising a base particle 2, a conductive layer 3 disposed on a surface of the base particle 2, and a plurality of metal materials disposed on an outer surface of the conductive layer 3, where a melting point of the metal material 4 is 300°C or more, the plurality of metal materials 4 as a whole is disposed on a portion on the outer surface of the conductive layer 3, and an ionization potential of a main metal of the metal material 4 is lower than the ionization potential of the main metal of the conductive layer 3.

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Inventors:

Masao Sasahira
Shigeo Mahara
Keizo Nishioka

Application Number:

JP2014243273A

Publication Date:

October 24, 2018

Filing Date:

December 01, 2014

Export Citation:

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