Title:
配線形成方法
Document Type and Number:
Japanese Patent JP6411539
Kind Code:
B2
Abstract:
To form wiring 72 on circuit board 34 and conductor body 60b, metal ink 70 containing metal particles is dispensed by inkjet head 24 straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device 26 to the dispensed metal ink. By this, the metal ink to which the laser is applied is baked and wiring 72 is formed. Here, a laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body By this, the metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.
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Inventors:
Yoshitaka Hashimoto
Fujita Masatoshi
Ken Tsukada
Akihiro Kawajiri
Masato Suzuki
Fujita Masatoshi
Ken Tsukada
Akihiro Kawajiri
Masato Suzuki
Application Number:
JP2016557419A
Publication Date:
October 24, 2018
Filing Date:
November 07, 2014
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K3/12; H05K3/10
Domestic Patent References:
| JP2009016724A | ||||
| JP8203898A | ||||
| JP2014185358A |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yuki Kataoka
Yuki Kataoka