Title:
樹脂モールド装置
Document Type and Number:
Japanese Patent JP6412776
Kind Code:
B2
Inventors:
Tatsuji Oguchi
Nobuhiro Kitajima
Kenji Kida
Kazuhiko Kobayashi
Nobuhiro Kitajima
Kenji Kida
Kazuhiko Kobayashi
Application Number:
JP2014234078A
Publication Date:
October 24, 2018
Filing Date:
November 19, 2014
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
H01L21/56; B29C33/68
Domestic Patent References:
| JP2003174049A | ||||
| JP2005183788A | ||||
| JP2004039823A | ||||
| JP2005219210A | ||||
| JP2013042017A | ||||
| JP2004179357A |
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office