Title:
フィルム成型用組成物
Document Type and Number:
Japanese Patent JP6412853
Kind Code:
B2
Abstract:
Provided is a composition for forming a film, the composition not having completely dissolved hydroxypropyl methyl cellulose (HPMC), and enabling formation of the film having a uniform thickness by suppressing the viscosity increase of the composition around an immersion temperature of 50°C. More specifically provided is a composition for forming a film, the composition comprising hypromellose having methoxy group content of 28.0 to 30.0% by weight and hydroxypropoxy group content of 7.6 to 8.5% by weight, wherein a 2% by weight aqueous solution of the hypromellose provides a viscosity at 20°C of 4.0 to 6.5 mPa·s, a 20% by weight dispersion of the hypromellose provides a viscosity at 50°C of 2,000 to 11,000 mPa·s, and a 20% by weight aqueous solution of the hypromellose provides a gelation temperature of 54 to 57°C; and a solvent.
Inventors:
Tatsuya Yamashita
Yokozawa Takuya
Naosuke Maruyama
Mitsuo Narita
Yokozawa Takuya
Naosuke Maruyama
Mitsuo Narita
Application Number:
JP2015245328A
Publication Date:
October 24, 2018
Filing Date:
December 16, 2015
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
A61K47/38; A61K9/48; C08B11/08
Domestic Patent References:
| JP2013539815A | ||||
| JP8208458A | ||||
| JP2000136126A | ||||
| JP2011500871A |
Attorney, Agent or Firm:
Mitsuo Matsui
Hidefumi Kawamura
Hidefumi Kawamura