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Patent Searching and Data


Title:
半導体装置の作製方法
Document Type and Number:
Japanese Patent JP6416316
Kind Code:
B2
Inventors:
山崎 舜平
岡崎 健一
肥塚 純一
佐々木 俊成
Application Number:
JP2017090183A
Publication Date:
October 31, 2018
Filing Date:
April 28, 2017
Export Citation:
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Assignee:
株式会社半導体エネルギー研究所
International Classes:
H01L21/336; H01L21/318; H01L21/8234; H01L21/8238; H01L21/8242; H01L27/06; H01L27/088; H01L27/092; H01L27/10; H01L27/108; H01L27/11551; H01L27/1156; H01L29/786
Domestic Patent References:
JP2012033836A
JP2012049513A
JP2012015436A
JP2007220817A
JP4367277A
JP2009272427A
JP2010141230A
JP2012119667A
Foreign References:
WO2009136645A2
US20120032173
US20120018727
US20120001167