Title:
セラミック多層配線基板の製造方法
Document Type and Number:
Japanese Patent JP6420088
Kind Code:
B2
Inventors:
Takayuki Nasu
Application Number:
JP2014163245A
Publication Date:
November 07, 2018
Filing Date:
August 09, 2014
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K3/02; H05K1/09; H05K3/46
Domestic Patent References:
| JP2001320151A | ||||
| JP2000252744A | ||||
| JP20017522A | ||||
| JP201021386A | ||||
| JP2000147758A |
Attorney, Agent or Firm:
Hisahiko Atsumi