柔らかな手触りのコポリアミド組成物

Title:

柔らかな手触りのコポリアミド組成物

Document Type and Number:

Japanese Patent JP6422990

Kind Code:

B2

Abstract:

Composition comprising, by weight, the total being equal to 100%: from 98% to 100% of at least one copolyamide comprising amide units and polyether units, having a melting point (Mp) from approximately 90 to approximately 150°C, in particular from approximately 100°C to approximately 125°C, and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); - from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, for the manufacture of a heat-sensitive adhesive, in particular a web, a film, granules, a filament, a grid, a powder or a suspension.

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Inventors:

Pinault, Quentin
Derbour, Bruno

Application Number:

JP2016557597A

Publication Date:

November 14, 2018

Filing Date:

March 05, 2015

Export Citation:

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