Title:
膜厚測定装置、及び、研磨装置
Document Type and Number:
Japanese Patent JP6423600
Kind Code:
B2
Abstract:
The present invention improves versatility of a film thickness measuring device. The trigger sensor 220 includes a proximity sensor 222 and a dog 224, and outputs a trigger signal indicating that a polishing table 110 makes one revolution. The eddy current sensor 210 measures a film thickness of a subject to be polished 102 at a timing based on the trigger signal output from the trigger sensor 220. The dog 224 is disposed in an opposite region 250 located at the opposite side of a rotation axis CW of the top ring 116 with respect to a rotation axis CT of the polishing table 110. Further, the eddy current sensor 210 and the proximity sensor 222 are disposed at the polishing table 110 so as to be located in the opposite region 250 when the trigger signal is output from the trigger sensor 220.
More Like This:
| JP5133046 | How to grind plate-shaped objects |
| JP6788416 | Grinding device |
Inventors:
Hiroyuki Shinozaki
Application Number:
JP2014048674A
Publication Date:
November 14, 2018
Filing Date:
March 12, 2014
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B49/04; B24B37/013; H01L21/304
Domestic Patent References:
| JP2004154928A | ||||
| JP2003534649A | ||||
| JP7235520A |
Foreign References:
| US6248000 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe