Title:
半導体装置
Document Type and Number:
Japanese Patent JP6424600
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device reducing the possibility of occurrence of peeling and breakage of an insulation resin sheet.SOLUTION: A semiconductor device according to the present invention comprises: a semiconductor module exposing a part of a heat radiation member and sealing a semiconductor element bonded with the heat radiation member on at least one principal surface; an insulation resin sheet bonded to a heat radiation surface of the semiconductor module including an exposure portion of the heat radiation member so as to cover the exposed portion; a radiator bonded to a surface not bonded with the semiconductor module of the insulation resin sheet; and a cooler bonded to a surface not bonded with the insulation resin sheet of the radiator via a seal member and cooling the radiator by using cooling water flowing through a cooling water channel. An end portion of the insulation resin sheet is positioned closer to an outside than an outer peripheral position of the seal member. An edge portion of the heat radiation surface of the semiconductor module is positioned closer to the outside than the outer peripheral position of the seal member.SELECTED DRAWING: Figure 1
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Inventors:
Takuya Gate
Kiyofumi Nakajima
Takashi Kimura
Yuki Ide
Kiyofumi Nakajima
Takashi Kimura
Yuki Ide
Application Number:
JP2014249303A
Publication Date:
November 21, 2018
Filing Date:
December 09, 2014
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
H01L23/473
Domestic Patent References:
| JP2010010504A | ||||
| JP2013048257A | ||||
| JP2010251382A |
Foreign References:
| WO2014181426A1 |
Attorney, Agent or Firm:
Patent business corporation Ogasawara patent office