Title:
エッチング液及びエッチング方法
Document Type and Number:
Japanese Patent JP6429079
Kind Code:
B2
Abstract:
An object of the present invention is to provide: an etching liquid which is capable of etching titanium selectively in the presence of copper, and is further low in toxicity and excellent in storage stability; and an etching method using this etching liquid. The etching liquid of the present invention which is a liquid includes at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid, and at least one organic sulfur compound selected from the group consisting of a thioketone compound and a thioether compound, and makes it possible to etch titanium selectively in the presence of copper.
More Like This:
Inventors:
Yuki Ogino
Mami Higashijima
General Hayashizaki
Minoru Otani
Mami Higashijima
General Hayashizaki
Minoru Otani
Application Number:
JP2015025385A
Publication Date:
November 28, 2018
Filing Date:
February 12, 2015
Export Citation:
Assignee:
MEC COMPANY
International Classes:
C23F1/44; C23F1/26
Domestic Patent References:
| JP54100945A | ||||
| JP61266582A | ||||
| JP63161178A | ||||
| JP6280056A | ||||
| JP200269656A | ||||
| JP2004221261A | ||||
| JP2013135039A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office