Title:
半導体装置および移動体
Document Type and Number:
Japanese Patent JP6429208
Kind Code:
B2
Abstract:
A semiconductor device (a semiconductor power module) 9 which comprises: a semiconductor chip 1; a ceramic substrate 5 that is connected to the semiconductor chip 1, with a solder alloy (a lead-free solder alloy) 2b being interposed therebetween; an external terminal that is electrically connected to the semiconductor chip 1; and a metal plate for heat dissipation 12 that is connected to the ceramic substrate 5, with a solder alloy (a lead-free solder alloy) 2c being interposed therebetween. The solder alloys 2b, 2c in the semiconductor device 9 are bonding materials, each of which is composed of 1-7% by weight of Cu and 3-15% by weight of Sb with the balance made up of Sn, and is bonded at a temperature of 280°C or more.
Inventors:
Takaaki Miyazaki
Yasushi Ikeda
Yasushi Ikeda
Application Number:
JP2016559781A
Publication Date:
November 28, 2018
Filing Date:
November 21, 2014
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/52; H01L29/861; H01L29/868
Domestic Patent References:
| JP2011044624A | ||||
| JP2004298931A | ||||
| JP2012009736A | ||||
| JP2007067158A | ||||
| JP2014060341A |
Attorney, Agent or Firm:
Tsutsui International Patent Office