Title:
発光装置の製造方法
Document Type and Number:
Japanese Patent JP6432343
Kind Code:
B2
Abstract:
A method of manufacturing a light-emitting device includes forming a separation layer on an upper surface of a supporting substrate; forming a plurality of external electrode layers on the separation layer; mounting a plurality of light-emitting elements on the external electrode layers; forming a plurality of resin layers between the supporting substrate and each of the light-emitting elements after mounting the light-emitting elements, the resin layers being formed such that the resin layers are separated from one another, and each resin layer underlies at least one light-emitting element; and applying laser light to the separation layer from a lower surface side of the supporting substrate, and separating the supporting substrate and the light-emitting elements from each other.
Inventors:
Akira Yoneda
Application Number:
JP2014266774A
Publication Date:
December 05, 2018
Filing Date:
December 26, 2014
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/48; H01L21/56
Domestic Patent References:
| JP2011181655A | ||||
| JP2011035040A | ||||
| JP2014045194A |
Foreign References:
| US20100096746 |
Attorney, Agent or Firm:
Masayuki Kanita