Title:
半導体装置
Document Type and Number:
Japanese Patent JP6432416
Kind Code:
B2
Abstract:
The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed.The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed.
Inventors:
Masashi Kuramoto
Toshifumi Imura
Tanisada Tomoki
Toshifumi Imura
Tanisada Tomoki
Application Number:
JP2015065053A
Publication Date:
December 05, 2018
Filing Date:
March 26, 2015
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L21/52; H01L33/48
Domestic Patent References:
| JP2012077171A | ||||
| JP2006210831A | ||||
| JP2008120850A | ||||
| JP2007036030A |
Foreign References:
| US20110291143 |
Other References:
Byung Mook Weon、外1名,Self-Pinning by Colloids Confined at a Contact Line,PHYSICAL REVIEW LETTERS [ONLINE],米国,American Physical Society,2013年 1月11日,第110巻,第2号,p.028303-1~028303-5,[DL from APS Journals]
Attorney, Agent or Firm:
Samejima Mutsumi
Keiichi
Keiichi