Title:
半仕上げ品を部分的に硬化させる方法および装置
Document Type and Number:
Japanese Patent JP6434974
Kind Code:
B2
Abstract:
Methods for using a mold to partially harden semifinished products, which are comprised of hardenable steel and have at least partially an open-profile or closed-profile cross section, may involve a number of steps. For example, such methods may involve heating regions of a semifinished product above an AC1 temperature, positioning the semifinished producing in a mold, positioning an active mold cooling element adjacent to or in contact with the heated regions of the semifinished product, and cooling the regions of the semifinished product at a defined cooling rate so that a hardened microstructure in the cooled regions. These methods and corresponding devices provide low cost solutions that dispense with complete hardening of semifinished products and/or employing welded connections to provide various mechanical properties.
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Inventors:
Zycola, Zasha
Golscher, Jörg
Pionek, David
Golscher, Jörg
Pionek, David
Application Number:
JP2016528464A
Publication Date:
December 05, 2018
Filing Date:
July 18, 2014
Export Citation:
Assignee:
THYSSENKRUPP STEEL EUROPE AG
International Classes:
C21D1/00; C21D1/18; C21D9/00
Domestic Patent References:
| JP2012149333A | ||||
| JP11140537A | ||||
| JP2011179028A | ||||
| JP2009534196A | ||||
| JP2000178640A |
Foreign References:
| WO2013001630A1 | ||||
| WO2008123506A1 | ||||
| US20120023748 |
Attorney, Agent or Firm:
Patent business corporation Kita Aoyama International
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