オルガノポリシロキサン、オルガノポリシロキサン組成物、オルガノポリシロキサンの製造方法、硬化性樹脂組成物、光半導体用封止材、光半導体用ダイボンド材、及び光半導体パッケージ

Title:

Document Type and Number:

Japanese Patent JP6438259

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide: organopolysiloxane capable of forming a cured article, sufficiently satisfying levels required especially for photosemiconductor applications of all properties such as thermal yellow discoloration resistance, light resistance, hardness and adhesiveness to a substrate at a good balance; a manufacturing method therefor; an organopolysiloxane composition; a curable resin composition using the same; an encapsulating material for photosemiconductor; a die bond material for photosemiconductor; and a semiconductor package.SOLUTION: There is provided organopolysiloxane having a constitutional unit F1, a constitutional unit M1 as units constituting cyclic organopolysiloxane.SELECTED DRAWING: None

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Inventors:

Yuji Okada

Application Number:

JP2014203429A

Publication Date:

December 12, 2018

Filing Date:

October 01, 2014

Export Citation:

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Assignee:

ASAHI KASEI KABUSHIKI KAISHA

International Classes:

C08F30/08; H01L21/027; H01L23/29; H01L23/31; H01L33/56

Domestic Patent References:

JP4217690A
JP2013032498A
JP2012237854A
JP2013079330A
JP2012211236A

Attorney, Agent or Firm:

Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito

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