Title:
半導体接合用接着フィルム及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6438340
Kind Code:
B2
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Inventors:
Wakioka Sayaka
Nishimura Yoshio
Nishimura Yoshio
Application Number:
JP2015079356A
Publication Date:
December 12, 2018
Filing Date:
April 08, 2015
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/60; C09J7/25; C09J7/35
Domestic Patent References:
| JP2015056479A | ||||
| JP2013102092A | ||||
| JP2012234804A |
Foreign References:
| WO2013133015A1 |
Attorney, Agent or Firm:
Atomi International Patent Office