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Title:
実装基板製造システム及び実装基板製造システムにおける基板下受け部材の設置方法
Document Type and Number:
Japanese Patent JP6439148
Kind Code:
B2
Inventors:
萬谷 正幸
坂上 隆昭
Application Number:
JP2016028462A
Publication Date:
December 19, 2018
Filing Date:
February 18, 2016
Export Citation:
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Assignee:
パナソニックIPマネジメント株式会社
International Classes:
H05K3/34; B41F15/08; B41F15/26; H05K13/04
Domestic Patent References:
JP2004273756A
JP2000124690A
JP3289198A
JP2012148475A
JP201338206A
Attorney, Agent or Firm:
鎌田 健司
前田 浩夫