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Title:
液体材料充填装置および方法
Document Type and Number:
Japanese Patent JP6445974
Kind Code:
B2
Abstract:
A liquid material filling device and method are provided which are intended to prevent air bubbles from remaining along an entire length of a flow passage extending from a liquid material reservoir (51) to a discharge port (53). The liquid material filling device includes a chamber (10) of an airtight structure, a pressure regulator (70) for regulating pressure in the chamber (10), and a control device (100). The liquid material is filled as follows. A negative pressure supply source (71) is communicated with a chamber communication pipe (90) and with a discharge device communication pipe (91) to reduce the pressure in the chamber (10) and pressure in an upper space of the reservoir (51) to a vacuum or a low pressure level close to a vacuum, and a resulted low-pressure state is maintained for a certain time to expel out air bubbles in the liquid material. The upper space of the reservoir (51) is then communicated with a gas supply port (93), thus allowing gas to flow into the relevant space and increasing the pressure in the relevant space to become higher than the pressure in the chamber (10) such that the liquid material within the reservoir (51) is filled into a discharge device (50). After communicating the upper space of the reservoir (51) with the inside of the chamber (10) and establishing a pressure equilibrium state, the upper space of the reservoir (51) is communicated with a gas supply port (92) to release the pressure.

Inventors:
Kazumasa Ikushima
Application Number:
JP2015540569A
Publication Date:
January 09, 2019
Filing Date:
October 03, 2014
Export Citation:
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Assignee:
Musashi Engineering Co., Ltd.
International Classes:
B05C5/00; B05C11/10; B05D1/26; B05D3/00
Domestic Patent References:
JP2009028676A
JP2004154765A
JP2004322099A
JP2009285603A
Foreign References:
WO2007097277A1
Attorney, Agent or Firm:
Akinobu Sudo
Asako Sudo