Title:
導電材スルーホール基板及びその製造方法
Document Type and Number:
Japanese Patent JP6446934
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive material through-hole board, where conductivity of a through electrode is enhanced for a deep through-hole of small opening size, at a low cost.SOLUTION: Surface wiring and through wiring are formed simultaneously, by forming a seed layer on the board surface and the through-hole inner wall, and performing conformal plating formation. By performing this processing from both sides of the board, a through electrode having a thick wiring on the through-hole inner wall can be formed even for a deep through-hole of small opening size. In other words, a conductive material through-hole board, where conductivity of a through electrode is high, can be provided.SELECTED DRAWING: Figure 3
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Inventors:
Masao Asano
Application Number:
JP2014190217A
Publication Date:
January 09, 2019
Filing Date:
September 18, 2014
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/42; H01L21/3205; H01L21/768; H01L23/12; H01L23/522
Domestic Patent References:
| JP2010238733A | ||||
| JP2010021327A | ||||
| JP2012169669A | ||||
| JP2010238786A | ||||
| JP1143292A | ||||
| JP2005310934A | ||||
| JP9307207A |
Foreign References:
| US20130175673 | ||||
| WO2011002022A1 |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners