Title:
センサ機器およびその製造方法
Document Type and Number:
Japanese Patent JP6447542
Kind Code:
B2
Abstract:
the present application relates to a sensor device (1), which includes a body case (10A) provided with an opening (14), and a body cover (10B) assembled to the body case (10A) to cover the opening (14). The body cover (10B) has at an outer peripheral portion thereof an overlapping region (OR) overlapping a portion of the body case (10A) located at a peripheral edge of the opening (14). The body cover (10B) is fixed to the body case (10A) by providing a welded portion (WP) surrounding the opening (14) using laser-welding at a portion distant from an end surface (10b) of the body cover (10B) in a boundary of the overlapping region (OR) of the body cover (10B) and a portion of the body case (10A) overlapping the overlapping region (OR).
Inventors:
Hiroyuki Mizusaki
Hiroki Nakajima
Hiroki Nakajima
Application Number:
JP2016041599A
Publication Date:
January 09, 2019
Filing Date:
March 03, 2016
Export Citation:
Assignee:
OMRON Corporation
International Classes:
H01H35/00; H01H11/00
Domestic Patent References:
| JP2011216372A | ||||
| JP2011105005A | ||||
| JP2009170133A |
Attorney, Agent or Firm:
Fukami patent office
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