Title:
リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP6460500
Kind Code:
B2
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Inventors:
Koji Tomita
Satoshi Shibasaki
Masaki Yazaki
Satoshi Shibasaki
Masaki Yazaki
Application Number:
JP2018004291A
Publication Date:
January 30, 2019
Filing Date:
January 15, 2018
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/50
Foreign References:
| US6927483 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Takuhisa Murata
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Takuhisa Murata
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