Title:
金属端子と回路基板の成形による接続方法及び接続体
Document Type and Number:
Japanese Patent JP6460780
Kind Code:
B2
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Inventors:
Daisuke Makino
Takashi Shinoki
Koji Mitsui
Takashi Shinoki
Koji Mitsui
Application Number:
JP2014262151A
Publication Date:
January 30, 2019
Filing Date:
December 25, 2014
Export Citation:
Assignee:
Teikoku Communication Industry Co., Ltd.
International Classes:
H01C17/28; B29C45/14; B29C45/26; B29C45/77; H01C10/38
Domestic Patent References:
| JP2012151404A | ||||
| JP2007331190A | ||||
| JP63169706A | ||||
| JP3074801A | ||||
| JP1050504A | ||||
| JP1166505A | ||||
| JP2003288971A |
Attorney, Agent or Firm:
Yu Takagi
Takashi Kumagai
Takashi Kumagai