Title:
合金
Document Type and Number:
Japanese Patent JP6464096
Kind Code:
B2
Abstract:
Solder alloy comprises 41-75 wt.% copper, 20-44 wt.% silver, 5-15% wt.% gallium, 0.1-15 wt.% further alloying elements comprising indium, tin, germanium, titanium, manganese, silicon and/or nickel, and unavoidable impurities containing = 0.01 wt.% zinc. Independent claims are included for: (1) a molded article containing the solder alloy contacting with at least one substrate; (2) producing the molded articles comprising forming the solder alloy to a thickness reduction during cold rolling of greater than 60% without performing a heat treatment; and (3) brazing substrates using the solder alloy at a soldering temperature with a lower limit of 0.3x (TL-Ts)+Ts+TL and an upper limit of 50 K, where TL is liquid temperature and Ts is solid temperature of respective solder alloy.
Inventors:
Gunter Wiel
Frank Jillz
Bernd Kemp
Frank Jillz
Bernd Kemp
Application Number:
JP2015553099A
Publication Date:
February 06, 2019
Filing Date:
January 17, 2014
Export Citation:
Assignee:
Umicore AG & Co.KG
International Classes:
B23K35/30; B23K1/00; B23K1/19; B23K31/02; C22C9/00
Domestic Patent References:
| JP4339590A | ||||
| JP61109018A | ||||
| JP8310877A | ||||
| JP7051887A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro