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Patent Searching and Data


Title:
発光装置
Document Type and Number:
Japanese Patent JP6466066
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent an extrusion from overlapping a terminal or a light-emitting part, when an adhesive located between a sealing member and a substrate extrudes.SOLUTION: Terminals 112, 132 of a light-emitting device 10 are located in a region of a substrate 100 on the outside of a sealing member 140. The sealing member 140 has a connection part 142. The connection part 142 faces the substrate 100, and surrounds a light-emitting element 102. An adhesive 150 is formed between the substrate 100 and connection part 142. The adhesive 150 connects the connection part 142 to the substrate 100. The connection part 142 has two first regions 144 and second regions 146. The two first regions 144 are arranged in a first direction (e.g., the x direction in the drawing), and the terminal 132 is held therebetween. The second regions 146 connect the two first regions 144, while avoiding the terminal 132.

Inventors:
Yuji Saito
Yoshihiro Katano
Okuyama Kenichi
Application Number:
JP2014020005A
Publication Date:
February 06, 2019
Filing Date:
February 05, 2014
Export Citation:
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Assignee:
Pioneer Corporation
Tohoku Pioneer Co., Ltd.
International Classes:
H01L51/50; H05B33/04; H05B33/06
Domestic Patent References:
JP2006196466A
JP2002198186A
JP2006066248A
JP5036476A
JP2006330185A
Attorney, Agent or Firm:
Shinji Hayami
Satoshi Amagi