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Title:
研磨又は研削パッド組立品
Document Type and Number:
Japanese Patent JP6466628
Kind Code:
B2
Abstract:
A floor polishing or grinding pad assembly (10) is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad (12), a reinforcement layer or ring (14; 114), and multiple floor-contacting disks (16; 16a; 16b; 16c; 116). In another aspect, the reinforcement layer includes a central hole (17) through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension (x) greater than a linear dimension (y) of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle (α) offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks (116) alternating between and/or offset from a larger set of the disks (16). In another aspect, the reinforcement layer includes a wavy or undulating internal edge (117) shape.

Inventors:
Chakalob, Chavda buoy.
Application Number:
JP2018526858A
Publication Date:
February 06, 2019
Filing Date:
September 23, 2016
Export Citation:
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Assignee:
Husqvarna Construction Products North America, Inc.
International Classes:
B24D7/08; A47L11/16; A47L13/16; B24B7/18
Domestic Patent References:
JP2004276197A
JP2012232378A
JP1117854U
JP2004025401A
JP2014513635A
JP49077293A
Foreign References:
US20130324021
US20130225051
US20110300784
US20090053982
US5054245
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Naoki Kono
Tadashi Inoue
Shigeru Iino
Sanae Kaneko
Ukai Ken