Title:
光半導体用シリコーン樹脂組成物の製造方法およびその硬化物の製造方法
Document Type and Number:
Japanese Patent JP6467492
Kind Code:
B2
Inventors:
Omoto Masanori
Anna Hirano
Kikuta Manabu
Anna Hirano
Kikuta Manabu
Application Number:
JP2017249013A
Publication Date:
February 13, 2019
Filing Date:
December 26, 2017
Export Citation:
Assignee:
Daiichi Kogyo Pharmaceutical Co., Ltd.
International Classes:
C08J3/215; C08K3/22; C08K9/06; C08L83/04; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP2014114194A | ||||
| JP2007308345A | ||||
| JP2012229317A | ||||
| JP2014122268A | ||||
| JP2012162740A |
Foreign References:
| WO2009096253A1 |
Attorney, Agent or Firm:
Patent business corporation Yuko patent office