Title:
溶接装置
Document Type and Number:
Japanese Patent JP6468513
Kind Code:
B2
Inventors:
Takeshi Oe
Satoshi Minowa
Kenichi Mori
Satoshi Minowa
Kenichi Mori
Application Number:
JP2015043820A
Publication Date:
February 13, 2019
Filing Date:
March 05, 2015
Export Citation:
Assignee:
Toshiba Plant Systems Co., Ltd.
Cutland Japan Co., Ltd.
Cutland Japan Co., Ltd.
International Classes:
B23K37/02; B23K9/028; F16H19/04
Domestic Patent References:
| JP1197065A | ||||
| JP8168880A | ||||
| JP5618193U | ||||
| JP5187502A | ||||
| JP1030702A |
Foreign References:
| US20130008881 |
Attorney, Agent or Firm:
Patent business corporation Tokyo International Patent Office