Title:
ボンディング装置及びボンディング方法
Document Type and Number:
Japanese Patent JP6470088
Kind Code:
B2
Inventors:
Keita Yamamoto
Yukio Tani
Hiroshi Maki
Yukio Tani
Hiroshi Maki
Application Number:
JP2015076049A
Publication Date:
February 13, 2019
Filing Date:
April 02, 2015
Export Citation:
Assignee:
Fasford Technology Co., Ltd.
International Classes:
H01L21/52; H01L21/60
Domestic Patent References:
| JP2010541293A | ||||
| JP2010153562A | ||||
| JP2005277271A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation