Title:
ＩＣタグ
Document Type and Number:
Japanese Patent JP6474235
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an IC tag in a UHF band, which can be made thin, can increase a communication range while having flexibility, and can be reduced in size to a degree not degrading workability upon mounting the tag.SOLUTION: The IC tag includes: a metal foil part 20 formed of a metal foil and generating static waves of a high-frequency current on a surface thereof; a dielectric layer 30; and an IC tag main body 40 mounted on the electric layer 30 and communicating with an external communication device, when a high-frequency current is applied to the metal foil part 20, by generating an electro-magnetic coupling with a coil antenna 43. The IC tag main body 40A is mounted on the dielectric layer 30 in such a manner that, when a gradient direction on a surface of the IC tag main body 40A where the coil antenna 43 is present is decomposed into a component in a thickness direction where the metal foil part 20 and the dielectric layer 30 are stacked and a component in a surface direction of the metal foil part 20, the component in the surface direction is larger than the component in the thickness direction.SELECTED DRAWING: Figure 1
Inventors:
Kunihiro Inoue
Yamauchi Shigeru
Masaaki Saruyama
Yamauchi Shigeru
Masaaki Saruyama
Application Number:
JP2014227578A
Publication Date:
February 27, 2019
Filing Date:
November 07, 2014
Export Citation:
Assignee:
Iro Co., Ltd.
Hitachi Systems Co., Ltd.
Hitachi Systems Co., Ltd.
International Classes:
G06K19/077; G06K19/02; H01Q7/00; H04B5/02
Domestic Patent References:
| JP2011204130A | ||||
| JP2010218537A | ||||
| JP2014194596A |
Attorney, Agent or Firm:
Iat International Patent Business Corporation