Title:
パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
Document Type and Number:
Japanese Patent JP6477328
Kind Code:
B2
Abstract:
To provide a manufacturing method with which a package and a light emitting device can be manufactured easily and in a thin size, as well as a package and a light emitting device with a thin size.SOLUTION: A method for manufacturing a package includes the steps of: preparing, in a region where the package is to be formed, two sets of lead frames in the vertical direction in plan view, the lead frame including, as one set, first and second electrodes and first and second suspension leads connected to the first and second electrodes, respectively; clamping the two sets of lead frames between an upper molding die and a lower molding die; injecting a first resin into the molding dies through an injection opening formed between the two sets of first or second suspension leads arranged in the vertical direction on the outside of the region where the package of the molding dies is to be formed; forming one package; curing or solidifying the first resin; and then cutting out an injection mark of the injection opening for the first resin from between the two sets of the first or second suspension leads.SELECTED DRAWING: Figure 11
Inventors:
Mayumi Fukuda
Application Number:
JP2015147971A
Publication Date:
March 06, 2019
Filing Date:
July 27, 2015
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/48; H01L33/60; H01L33/62
Domestic Patent References:
| JP2011119729A | ||||
| JP2010062272A | ||||
| JP2015005584A | ||||
| JP2008098218A | ||||
| JP2010251493A | ||||
| JP3168024U | ||||
| JP2008251937A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation