Title:
三次元構造物の造形方法及び三次元構造物の造形装置
Document Type and Number:
Japanese Patent JP6478212
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To precisely mold a three-dimensional structure speedily and directly by using a low power laser, without using a support member for supporting a shape of the three-dimensional structure, in a molding process of a three-dimensional structure.SOLUTION: A method for molding a three-dimensional structure is for molding a three-dimensional structure 513 on a support medium 13. The method for molding a three-dimensional structure includes: a discharge process of discharging powder to a support medium 13; a fixed powder layer formation process of using a fixation agent 502 for fixing powder 501 on a support medium to form a fixed powder layer 504 obtained by fixing the powder 501 on the support medium 13; and a sintering process of forming a sintered layer 505 obtained by sintering the fixed powder layer 504.
Inventors:
Chen
Application Number:
JP2013221201A
Publication Date:
March 06, 2019
Filing Date:
October 24, 2013
Export Citation:
Assignee:
株式会社リコー
International Classes:
B22F3/105; B22F3/16; B29C67/00
Domestic Patent References:
| JP11508326A |
Foreign References:
| WO2007010598A1 |
Attorney, Agent or Firm:
Takashi Satoru
Takashi Munakata
Takashi Munakata