Title:
変形可能な装置及び方法
Document Type and Number:
Japanese Patent JP6480576
Kind Code:
B2
Abstract:
An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.
Inventors:
Daryl cotton
Adam Robinson
Pears Andrew
Adam Robinson
Pears Andrew
Application Number:
JP2017520341A
Publication Date:
March 13, 2019
Filing Date:
October 12, 2015
Export Citation:
Assignee:
Nokia Technologies Yusuke Osamu
International Classes:
G01D21/00; G01D5/16; G01K1/08; G01K7/16; G01N27/00; G01N27/04
Foreign References:
| WO2014124049A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Kei Mori
Masami Enohara
Jun Tsuruta
Kei Mori
Masami Enohara