Title:
電子回路部品装着機
Document Type and Number:
Japanese Patent JP6482623
Kind Code:
B2
Inventors:
Mizuho Nozawa
Kento Okada
Kento Okada
Application Number:
JP2017184688A
Publication Date:
March 13, 2019
Filing Date:
September 26, 2017
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04; H05K13/02
Domestic Patent References:
| JP2006128166A | ||||
| JP2002280793A | ||||
| JP2010079792A1 | ||||
| JP11046088A | ||||
| JP2006120676A | ||||
| JP9199890A |
Attorney, Agent or Firm:
Yuki Kataoka