Title:
導電フィルム及び接続構造体
Document Type and Number:
Japanese Patent JP6483958
Kind Code:
B2
Inventors:
Shigeo Mahara
Shinya Uenoyama
Shinya Uenoyama
Application Number:
JP2014056615A
Publication Date:
March 13, 2019
Filing Date:
March 19, 2014
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/16; B32B27/18; H01B1/00; H01B1/22; H01R11/01
Domestic Patent References:
| JP2006228474A | ||||
| JP201140189A | ||||
| JP200735575A | ||||
| JP2012234804A |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office
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