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Patent Searching and Data


Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP6484019
Kind Code:
B2
Inventors:
木田 健司
佐藤 寿
Application Number:
JP2014251147A
Publication Date:
March 13, 2019
Filing Date:
December 11, 2014
Export Citation:
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Assignee:
アピックヤマダ株式会社
International Classes:
H01L21/56; H01L23/00; H01L23/28
Domestic Patent References:
JP2014157897A
JP2003165134A
JP2011151226A
JP2009094095A
JP2012160576A
JP2010109274A
Attorney, Agent or Firm:
藤元 亮輔