Title:
電子装置及びその製造方法
Document Type and Number:
Japanese Patent JP6485398
Kind Code:
B2
Abstract:
In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.
Inventors:
Masanori Oshima
Eiji Hayashi
Eiji Hayashi
Application Number:
JP2016080578A
Publication Date:
March 20, 2019
Filing Date:
April 13, 2016
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/48; G01N29/04; H01L23/28; H01L23/29; H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| JP20164941A | ||||
| JP3222465A | ||||
| JP2009182159A | ||||
| JP2013247256A |
Foreign References:
| WO2015151273A1 |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo