Title:
持続的ボンディングのための方法及び装置
Document Type and Number:
Japanese Patent JP6486386
Kind Code:
B2
Abstract:
A method and corresponding device for permanent bonding of a first layer of a first substrate to a second layer of a second substrate on a bond interface, characterized in that a dislocation density of a dislocation of the first and/or second layer is increased at least in the region of the bond interface before and/or during the bonding.
Inventors:
Marks Vimpinger
Bearn Heart Rapehan
Bearn Heart Rapehan
Application Number:
JP2016566671A
Publication Date:
March 20, 2019
Filing Date:
April 22, 2015
Export Citation:
Assignee:
Afau Group A Tarner Gamebehr
International Classes:
H01L21/02; B23K20/10
Domestic Patent References:
| JP2008258426A | ||||
| JP63063584A | ||||
| JP2002103055A | ||||
| JP2005294824A |
Foreign References:
| WO2013110315A1 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
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