Title:
導電性ペースト
Document Type and Number:
Japanese Patent JP6488156
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste corresponding to a super-narrow pitch, excellent in conductivity and capable of forming an electrode or an electrical wiring, etc., having a fine line width at a low cost.SOLUTION: The conductive paste includes a spherical silver coated resins having a resin surface coated with silver and flat-like silver particles as a conductive filler. A mass ratio of the silver coated resins and the silver particles is 95:5-5:95; a content ratio of the conductive filler is 70-90 mass%; the average particle size of the silver coated resins is in a range of 0.6-6.0 μm; the average particle size of the silver particles is 5.5 μm or less; the specific gravity of the silver coated resin is 1.4-6.0; and a ratio of silver of the silver coated layer occupied in the silver coated resin is 20-90 mass%.SELECTED DRAWING: None
Inventors:
Hirokazu Tsukada
Kensuke Kageyama
Kensuke Kageyama
Application Number:
JP2015044773A
Publication Date:
March 20, 2019
Filing Date:
March 06, 2015
Export Citation:
Assignee:
Mitsubishi Materials Electronic Chemicals Co., Ltd.
International Classes:
H01B1/22; C23C18/44; H01B1/00
Domestic Patent References:
| JP6338216A | ||||
| JP2015130420A | ||||
| JP2011198674A |
Attorney, Agent or Firm:
Masayoshi Suda