Title:
ウェハ欠陥発見
Document Type and Number:
Japanese Patent JP6490211
Kind Code:
B2
Abstract:
Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
Inventors:
Chen Hong
Wu Kennon
Purihal Martin
Pandita Vidur
Sanapara Ravikumar
Bagat Vivek
Rakwaat Rahul
Barry oxen
Ramachandran Rajesh
Hakuenoashin
Wu Kennon
Purihal Martin
Pandita Vidur
Sanapara Ravikumar
Bagat Vivek
Rakwaat Rahul
Barry oxen
Ramachandran Rajesh
Hakuenoashin
Application Number:
JP2017524360A
Publication Date:
March 27, 2019
Filing Date:
November 04, 2015
Export Citation:
Assignee:
KLA-Tenker Corporation
International Classes:
H01L21/66; G01N21/956; G01N23/2251
Domestic Patent References:
| JP2011522418A | ||||
| JP200882821A | ||||
| JP201189976A |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office