Title:
半導体装置
Document Type and Number:
Japanese Patent JP6493005
Kind Code:
B2
Inventors:
Hiroyuki Tarumi
Kazuhiro Koyama
Kazuhiro Koyama
Application Number:
JP2015122166A
Publication Date:
April 03, 2019
Filing Date:
June 17, 2015
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/338; H01L21/336; H01L29/778; H01L29/78; H01L29/812
Domestic Patent References:
| JP2014222763A | ||||
| JP2008153330A | ||||
| JP2014154729A | ||||
| JP6232179A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office