Title:
超音波トランスデューサチップアセンブリ、超音波プローブ、超音波イメージングシステム並びに超音波アセンブリ及びプローブ製造方法
Document Type and Number:
Japanese Patent JP6495338
Kind Code:
B2
Abstract:
Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
Inventors:
We Kamp Johannes Wilhelms
Henneken Vincent Adriatic
Greenland Alphonse Water
Lowworth Marcus Cornelis
Henneken Vincent Adriatic
Greenland Alphonse Water
Lowworth Marcus Cornelis
Application Number:
JP2016566926A
Publication Date:
April 03, 2019
Filing Date:
May 05, 2015
Export Citation:
Assignee:
KONINKLIJKE PHILIPS N.V.
International Classes:
H04R1/06; A61B8/14; H04R17/00; H04R19/00; H04R31/00
Domestic Patent References:
| JP2013175878A | ||||
| JP2177944A | ||||
| JP2013005403A | ||||
| JP2010193072A | ||||
| JP2006122105A |
Foreign References:
| WO2010044312A1 | ||||
| WO2009139400A1 |
Attorney, Agent or Firm:
Patent Services Corporation m&s Partners