Title:
三つ以上の電極を備えたチップ電子部品検査選別装置
Document Type and Number:
Japanese Patent JP6496151
Kind Code:
B2
Abstract:
Provided is a chip electronic component inspection sorting device that allows for high speed inspection and sorting of chip electronic components that are mass-produced and have three or more electrodes. An inspection sorting device for chip electronic components having three or more electrodes is characterized by comprising a base; chip electronic component transportation disk that is rotatably supported on the base (however, the transportation disk comprises, formed therein, through holes that have a rectangular opening for temporarily receiving therein a cuboid-shaped chip electronic component having three or more electrodes with a surface thereof having the largest surface area as the bottom surface, and that are formed in such a way as being arranged along a circumference to form two arrays each comprising two or more through holes with long sides of the rectangular openings disposed side by side in a radial direction of the transportation disk); chip electronic component supplying and receiving sections that are arranged in sequence along a rotating path of the transportation disk to have chip electronic components supplied and received in the through holes of the transportation disk (however, the chip electronic component supplying and receiving section comprises means for supplying the chip electronic components in a random state to locations close to the through holes of the transportation disk and, subsequently, having the chip electronic components, which are at locations where a side thereof is opposite to a side of the rectangular openings of the through holes, erected and temporarily held at the sites of the through holes of the transportation disk with an end face thereof as a bottom surface, and comprises a means for subsequently pushing down the chip electronic components that are disposed to be erected and held in the through holes so as to have the chip electronic components set in the through holes with the surface thereof that has the largest surface area as the bottom surface); an electric property inspection section that inspects the electrical property of the chip electronic components; and a sorting section that sorts the inspected chip electronic components based on the result of inspection.
Inventors:
Suzuki Takuji
Nobuo Sawa
Masaya Hagita
Nobuo Sawa
Masaya Hagita
Application Number:
JP2015013128A
Publication Date:
April 03, 2019
Filing Date:
January 27, 2015
Export Citation:
Assignee:
Human Laboratory Co., Ltd.
International Classes:
H01G13/00; B07C5/344; G01R31/00
Domestic Patent References:
| JP3021100A | ||||
| JP2001026318A | ||||
| JP10319043A |
Foreign References:
| WO2014010623A1 |
Attorney, Agent or Firm:
Yanagawa Yasuo