Title:
レーザー加工装置
Document Type and Number:
Japanese Patent JP6501530
Kind Code:
B2
Abstract:
A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb−ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.
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Inventors:
Sanbe Takashi
Application Number:
JP2015009273A
Publication Date:
April 17, 2019
Filing Date:
January 21, 2015
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23K26/00; B23K26/351
Domestic Patent References:
| JP2012161799A | ||||
| JP2008042032A | ||||
| JP2000106340A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Tomohiro Okamoto