Title:
回路基板とその製造方法
Document Type and Number:
Japanese Patent JP6502204
Kind Code:
B2
More Like This:
Inventors:
Kiyoshi Shimizu
Tsutsuo Watanabe
Hiroshi Kaneda
Junichiro Harue
Tsutsuo Watanabe
Hiroshi Kaneda
Junichiro Harue
Application Number:
JP2015154094A
Publication Date:
April 17, 2019
Filing Date:
August 04, 2015
Export Citation:
Assignee:
Daicel Corporation
International Classes:
H05K3/10; H05K3/00; H05K3/12; H05K3/38
Domestic Patent References:
| JP2009064888A | ||||
| JP2014196448A | ||||
| JP2000216521A | ||||
| JP2010010500A | ||||
| JP5335693A | ||||
| JP2012227321A | ||||
| JP2013062293A | ||||
| JP8148805A | ||||
| JP2005079276A | ||||
| JP2010080946A | ||||
| JP2014533775A |
Attorney, Agent or Firm:
Satoshi Furuya
Yoshitsune Kazumasa
Yoshitsune Kazumasa